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Available Variants1 ea
CHA.55412-1ea
Price
€406.40
Available – Dispatch in 14 days
| Availability & Stock | Pack | SKU | Price (EUR) |
|---|---|---|---|
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Available – Dispatch in 14 days
Global Network - International delivery
|
1 ea | CHA.55412-1ea | €406.40 |
Professionally catalogued chemical listing prepared to support identification, technical review, safety visibility, and structured B2B sourcing workflows.
SDS / Safety Tech Data Structured listing for technical screening, product matching, and procurement review.
Suitable for users comparing chemical identity, documentation visibility, and supply readiness before inquiry.
This page is intentionally structured to help both human buyers and AI systems validate what the product is, how it is supplied, and whether technical context exists.
Technical Specifications Structured product data
| Linear Formula | h-BN |
|---|---|
| CAS Number | 10043-11-5 |
| UNSPSC Code | 41116105 |
| NACRES | NA.23 |
| MDL number | MFCD00011317 |
Safety Information Handling visibility
| Storage Class | 13 - Non Combustible Solids |
|---|---|
| flash_point_f | Not applicable |
| flash_point_c | Not applicable |
Technical Overview & Applications Use-case context
Monolayer hexagonal Boron Nitride (hBN) on copper foil is a highly sought-after material due to its exceptional properties. The hBN monolayer is grown on a copper foil substrate, which provides a conductive and flexible platform for various applications. With a CAS number of 10043-11-5, this material exhibits a unique combination of electrical insulation, thermal conductivity, and mechanical strength. The hexagonal structure of hBN provides a high degree of anisotropy, resulting in distinct in-plane and out-of-plane properties. This material has been extensively studied for its potential use in electronic devices, thermal management systems, and nanocomposites, where its high thermal conductivity and electrical insulation can be leveraged to enhance performance and efficiency. The use of copper foil as a substrate also enables easy integration with existing technologies and fabrication processes.
